The propagation delay from input to switching of the high side low side drivers is 1µs max.
High side switch chip.
The high side drivers come with high side referenced output channels to control power devices like mosfets and igbts.
The switch is controlled by a logic enable compatible with 5 v logic and 3 v logic.
The max14912 max14913 have eight 640ma smart high side switches that can also be configured as push pull drivers for high speed switching.
The spi interface has a built in chip addressing decoder allowing communication with multiple max14915s utilizing a common spi chip select active low cs.
With over current shutdown and a fault flag.
A useful circuit to have in designer s toolbox is the high side switch.
1000 pf in 60 µs.
1000 pf in 60µs.
Gate drive is provided by an internal charge pump designed to control the power switch rise times and fall times to minimize current surges during switching.
These devices are 50 m n channel mosfet high side power switches.
High side or low side single.
The high side switches have on resistance of 250mω max at 125 c ambient temperature.
Each high side driver has a low on resistance of 230mω max at 500ma load current at t a 125 c.
This transistor connects between v and the load.
St offers a series of intelligent power switches ips for high side and low side configurations.
The opposite of the low side switch is the high side switch.
These devices integrate the control section logic interface drivers diagnostic and protection features and the power stage on the same chip with benefits in terms of compactness increased system reliability and cost effectiveness.
They are perfect for applications like aircon automotive solar.
High side or low side single.
Less than 1µa in standby mode.
A larger chip.
The max14915 has eight high side switches specified to deliver up to 700ma continuous current.
Like it sounds this is a circuit that switches the high side or positive voltage to a load.
Typically these use a pnp bjt or p channel mosfet.
High side switches can safely drive high currents into complex resistive inductive and capacitive grounded loads in compliance with the harsh automotive environment.